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D-Sub高導熱系數接入器AMPHENOL

推送日期：2023-09-06 16:40:00     手機瀏覽：961

AMPHENOL的D-Subminiature高密度產品系列為線路板和電纜線末端提供各種線接選擇，明顯減少了電纜組件和連接器整體成本。接線端子包含板側的直立式、直角、SMT、電纜接頭和超薄型沉頭接線端子，及其電纜線側的焊杯、電纜接頭、IDC帶條狀、無焊繞線和螺母接線端子。各個線接規格都有插座和插頭連接器。

D-Sub低密度計算公式接器銳角PCB線接有這兩種封裝形勢經典款：美國籌劃和航天軍工用形勢。配板遇到接觸面一直以來都為金黃的什么色，能隨著所必需要的足夠的配頻段抉擇分為三類幾乎板厚：閃光彈金、15μ"和30μ"。了解點并能給出高五金制品化加工工藝的軍品用級最新版本（額定負載電流量高至7.5A）以擔保的安全正規性，能夠夠帶來更經濟性且可商用機的功率直流電為3A的機加工版本信息。

D-Sub高相對密度鏈接器基準系列表常從A到E的5種基礎殼體品種，AMPHENOL的結合連入器在數據資料訊號、24v電源和同軸纜線問題享有高達hg18個沾染點排列成。堆疊（雙表層）D-Sub高相對密度連到器成品產品等同于豐富性。AMPHENOL新開設發的用到PIP錫焊細長（或沉式或短型）系列產品在AMPHENOL的餐飲業大家中收獲獲得成交。除此模版，AMPHENOL還就可以為所有app展示生產機械，含有不銹鋼蓋、PVC除塵蓋、維護罩、安裝生產機械、胎兒性別轉換成和沒有更換器。

特征英文

細則D形連結器

EMI不銹鋼殼子

充電插頭接地極裝制凹坑

插到件由阻燃劑熱塑性樹脂變形塑料材質打造而成

軟件金融業公司公章接受點

要具備全座向線接範圍的變體

不同線接規格為均作為電源插座和電源線插頭

優勢與劣勢

保證 合理的的結合方法

最主要的用在批處理工作但拉低料工費的防止細則

UL#E232356v認證

兼容多種多樣使用者需要

不符合基準規范性

特定系類合適于管腳焊錫膏或吸附焊接方法

河南市立維創展創新科技選擇代理商AMPHENOL企業各種區域產品的一系列，在AMPHENOL，AMPHENOL我想在積極開展行業的環節中弄出維持性的選購能夠 為大股東創設一年期和持續價值觀。AMPHENOL的每項項業務部都專注于于快速改進什么其制定，的采購，制作和交貨產品設備的的方試，積極滿意或趕超客對整總產品設備鏈中產品設備的監管的能夠。AMPHENOL 的業務量將衛生和環境治理的做為關鍵每日任務，并依照ISO 14001和OHSAS 18001等認同的標準安全管理這種方案。有時候，認正和法令安全性還遠遠不夠。AMPHENOL不光僅自覺遵守標準就能打造長時間顏值。

詳細信息知道AMPHENOL可點擊：//www.takasago.net.cn/article/1321.html

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PART NUMBER

DESCRIPTION

G17DC15023313HR

Dsub Slim Right Angle Dip, High Density 15 Position Receptacle VGA, Sunk 4.27mm, 15μin Au, Footprint 1.6mm, 2 Rows, Pitch 1.0mm, Post distance 1.4mm, PCB hole distance 2.3mm, Tail 3.05mm, Tape and Reel with Cap, Blue 661C, PIP, Halogon Free

G17DD1504232GHR

G17DD1504232GHR-Slim Right Angle Dip HD 15P Receptacle

G17DD1504232RHR

G17DD1504232RHR-Slim Right Angle Dip HD 15PReceptacle

G17DD1504232SHR

G17DD1504232SHR-Slim Right Angle Dip HD 15P Receptacle

L177HDA26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH3R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDA26SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDA26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 26 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDA26SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock

L177HDAG26S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock

L177HDAG26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAG26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock

L177HDAH26SOL2RM5

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Rear Insert, 4-40 Threaded Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SOL2RM8

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, 4-40 Fixed Front Screwlock, Standoff 6.0mm (0.236"), With Boardlock 4.2mm (0.165")

L177HDAH26SVF

Dsub, Stamped Signal 3A, Straight Soldercup, 26 Socket, Bright Tin Shell, 0.38m (15 in) Gold, 4-40 Removable Front Screwlock, 4-40 Threaded Nut

L177HDB44S

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SD1CH3F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4F

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Front Screwlock, Ground Tab, With Boardlock

L177HDB44SD1CH4R

Dsub, Stamped Signal 3A, High Density, Right Angle PCB Through Hole, FP=8.89mm (0.35μin), 44 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock

L177HDB44SOL2

Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 44 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock

L177HDB44SVF

Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 44 Socket, 0.38m (15 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock


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