中文翻譯
微波加熱元集成電路芯片
4 Pad Chips
| Part Number | Capacitance (pF)1 | Chip Style | ||||||
|---|---|---|---|---|---|---|---|---|
| Pad 1 | Pad 2 | Pad 3 | Pad 4 | Total | BOO | BSP-1 | BSP-3 | |
| 611R5K-XXX | 0.1 | 0.2 | 0.4 | 0.8 | 1.5 | √ | √ | |
| 613R0K-XXX | 0.2 | 0.4 | 0.8 | 1.6 | 3.0 | √ | √ | √ |
| 613R7K-XXX | 0.25 | 0.5 | 1.0 | 2.0 | 3.75 | √ | √ | √ |
| 615R6K-XXX | 0.4 | 0.8 | 1.5 | 3.0 | 5.6 | √ | √ | √ |
| 617R5K-XXX | 0.5 | 1.0 | 2.0 | 4.0 | 7.5 | √ | √ | |
| 6115RK-XXX | 1.0 | 2.0 | 4.0 | 8.0 | 15.0 | √ | √ | |
| 6122R5K-XXX | 1.5 | 3.0 | 6.0 | 12.0 | 22.5 | √ | √ | |